IC Fabrication Process

IC Fabrication is a complicated process. Try to describe this process simply....

At first, select a P - type or N - type material as a substrate. Here only consider a P - type material as a substrate.

Then add the SiO₂ solution. The layer of SiO₂ is placed on the surface uniformly of the substrate.

A positive photoresist is placed on the thin layer of SiO_2..

A mask is designed & placed on the photoresist layer.

After that UV light is applied over the mask.

Due to positive photoresist the portion of non mask area get soluble.

Now etch the SiO₂ according to the positive photoresist pattern.

Removed the positive photoresist.

Since the substrate that is used a P - type material therefore N - type material is pushed in the substrate which is etched according to the pattern.

For getting a P - type contact on that substrate the above process might be repeated.

For insulation Al₂O3 is used on that material.